India, Uzbekistan reaffirm to boost long-term cooperation

India and Uzbekistan have reaffirmed their interest in strengthening the long-term cooperation between the two nations.

Uzbek President  Shavkat Mirziyoyev and  Prime Minister Narendra Modi agreed to further deepen strategic partnership in the areas such as political ties, security, counter-terrorism, trade and investment, science and technology, nuclear energy, as well as cultural and academic linkages.

The two leaders discussed the situation in Afghanistan and noted that establishment of peace and stability in that country is of great significance to ensure security and stability of the entire region.

In a Joint Statement, issued after talks between Prime Minister Narendra Modi and the visiting Uzbekistan President Mr. Shavkat Mirziyoyev, both the sides reiterated support for the efforts of the Governments and the people for a genuine Afghan-owned, Afghan-led and Afghan-controlled peace and reconciliation process that would allow for a peaceful, secure, united, inclusive and prosperous nation.

The two countries shared the view that countering terrorism in all its forms and manifestations without distinction is important for sustainable peace and security in Afghanistan. They expressed continued support for the reconstruction and revival of that country.

India and Uzbekistan also agreed to expand cooperation in the IT Sector. They expressed their readiness to explore possibilities of cooperation for the opening of branches of Indian Universities/Institutions in the IT, Tourism and hotel management sector in Uzbekistan.

The Uzbek side expressed their interest for the establishment of an IT Park in Uzbekistan in cooperation with Indian IT companies based on their best practices on software industry development and acceleration of startups.

They agreed to develop mutually beneficial cooperation in transport and communications. Both the countries favoured the introduction of direct flights between Tashkent and Mumbai and agreed to explore various options to enhance surface connectivity between them.

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